Mainly Material of ceramic substrates:
Usually the ceramic substrates are aluminum nitride ceramic substrates and alumina ceramic substrates.
Features of Alumina Ceramic：
1.They have high mechanical strength. The flexural strength of sintered alumina ceramic products can reach 250MPa, and that of hot-pressed products can reach 500MPa. The strength can be maintained up to 900℃ at high temperatures.
2. High alumina ceramics have a high resistivity and excellent electrical insulation performance. The resistivity at room temperature is 1015Ω·cm, and the insulation strength is 15kV/mm.
3.High hardness, with a Mohs hardness of 9.
FEATURES OF ALUMINIUM NITRIDE CERAMIC：
1.The coefficient of thermal expansion is (4.0-6.0) × 10-6/℃, and the thermal conductivity of polycrystalline AIN reaches 260W/(m.k), which is 5-8 times higher than that of alumina. Therefore, it has good thermal shock resistance and can withstand extreme heat up to 2200℃.
2.Aluminum nitride has the characteristic of being resistant to erosion by molten aluminum,other molten metals and gallium arsenide, especially having excellent resistance to erosion by molten aluminum.
Application of ceramic substrates:
1.High-power power semiconductor module Semiconductor coolers, electronic heaters Radio frequency power control circuit, power mixing circuit.
2.Intelligent power component High-frequency switching power supply, solid state relay.
3.Automotive electronics, aerospace and military electronic components.
4.Solar panel assembly Telecommunication dedicated switch, receiving system Industrial electronics such as lasers.